IndieSemiC and Kaynes Semicon Sign MoU

IndieSemiC, an Ahmedabad-based fabless chip design company, and Kaynes Semicon Private Limited have signed a Memorandum of Understanding for a strategic Outsourced Semiconductor Assembly and Test (OSAT) collaboration, aimed at strengthening India’s semiconductor packaging and manufacturing ecosystem.

The MoU establishes a framework for the qualification, assembly and testing of QFN, BGA and other mutually agreed semiconductor packages, supporting IndieSemiC’s portfolio of ultra-low-power, compact SiP modules and discrete semiconductor devices. Beyond assembly and testing, the collaboration also covers Design for Manufacturability, customized SiP and package co-development and New Package Introduction as IndieSemiC’s product portfolio expands.

The MoU was signed by Nikul Shah, Founder and CEO and Jinal Shah, CMO, of IndieSemiC, alongside Raghu Panicker, CEO, Kaynes Semicon. The partnership brings together IndieSemiC’s chip design capabilities with Kaynes Semicon’s OSAT infrastructure within a single integrated framework, laying the groundwork for future package expansion opportunities as IndieSemiC’s product roadmap grows.

“This partnership with Kaynes Semicon reflects where India’s semiconductor industry needs to go next: from isolated pockets of capability to a genuinely integrated value chain, where design and backend manufacturing move in lockstep,” said Nikul Shah, Founder and CEO, IndieSemiC.